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詳細情報 |
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| 保管温度: | -20～70℃ | センサーの種類: | OV7725 |
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| レンズビュー: | FOV120°(オプション)、F/N(オプション) | テレビの歪み: | <1% (オプション) |
| 寸法: | 12.5*19.95mm （カスタマイズ可能） | ピクセルサイズ: | 1.4μm × 1.4μm |
| 有効画素数: | 640*480 | 納期: | 0〜60℃ |
| イメージセンサー: | 1/4」 | 取付タイプ: | 全て |
| ハイライト: | OV7725 sensor USB camera module,640x480 resolution camera module,120 FOV vision solution module |
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製品の説明
OV7725 Sensor USB Camera Module
High-quality customizable vision solution with 640x480 resolution, 1.4μm pixel size, and 120° field of view.
Technical Specifications
| Pixel Size | 1.4μm x 1.4μm |
| Effective Pixels | 640×480 |
| Image Sensor | 1/4" |
| Sensor Type | OV7725 |
| Lens View | FOV120° (Optional), F/N (Optional) |
| TV Distortion | <1% (Optional) |
| Operating Temperature | 0~60℃ |
| Storage Temperature | -20~70℃ |
| Dimension | 12.5×19.95mm (Customizable) |
Product Images
Company Profile
Shenzhen Sinoseen Technology Co., Ltd was established in March 2009. For decades, Sinoseen has been dedicated to providing customers with various OEM/ODM customized CMOS image processing solutions from design and development, manufacturing, to after-sales one-stop service. We are confident to offer customers the most competitive price and quality. Our products include USB camera modules, mobile phone camera modules, notebook camera modules, security cameras, car cameras and smart home camera products. We provide the best camera module solutions for any application.
Application Areas
- Machine vision and intelligent systems
- Future security and optical technology solutions
- Camera module customized solutions
- Internet of Things end-to-end solutions
- Iris recognition and face recognition technology
- VR and high-end camera solutions
- Smart home and intelligent hardware solutions
- UAV and drone solutions with specialized modules
- Aerial filming and optical technology solutions
- Mobile phone camera modules and optronic solutions
- Imaging technology and video technology solutions
- Infrared imagers for industry and embedded systems
Customization Process
Our customization process begins with understanding your specific application requirements. We consider product structure size, image definition, frame rate, lens angle, lighting conditions, and other factors to select the appropriate DSP chip, sensor, and lens configuration.
Customization Steps
- Analyze your application scene and functional requirements
- Select appropriate DSP chip, sensor, and lens based on structural requirements, lighting conditions, and cost targets
- Design product PCBA according to structural specifications
- Adjust parameters such as color, white balance, and saturation for optimal performance in your environment
Our Advantages
Certifications
Packing & Delivery
Frequently Asked Questions
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